EFTA Document EFTA01446639
21 November 2013 Semiconductors Intel Segment Update Manufacturing: Intel's costs are coming down quickly Intel expects costs declines to accelerate as the company migrates to 14nm in 2014 and lOnm thereafter. This will contrast to the foundry industry which is likely to see a flattening of the cost curve as they introduce FinFet into high volume manufacturing. Intel is not immune to rising wafer costs, but the company believes it can deliver higher density which will offset the higher
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21 November 2013 Semiconductors Intel Segment Update Manufacturing: Intel's costs are coming down quickly Intel expects costs declines to accelerate as the company migrates to 14nm in 2014 and lOnm thereafter. This will contrast to the foundry industry which is likely to see a flattening of the cost curve as they introduce FinFet into high volume manufacturing. Intel is not immune to rising wafer costs, but the company believes it can deliver higher density which will offset the higher
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